Call For Papers

Call for Papers

Conference Submissions

The 1st International Conference on Advances in Additive Manufacturing and Emerging Materials Processing (ICAMMP-2025) is a scientific forum dedicated to the advancement of knowledge in the fields of materials science, additive manufacturing physics, and emerging materials processing methods. The conference aims to facilitate in-depth technical discussions on critical topics such as microstructure and phase evolution, thermophysical property measurement, surface and interface phenomena, and advanced experimental characterization.

Submissions are invited on both experimental and computational studies, including but not limited to:

Track 1. Functional and Smart Materials
1. Ferrous and non-ferrous materials
2. Composites
3. Micro / Nano Materials
4. Ceramics
5. Functional Materials
6. Biomaterials
7. Smart/Intelligent Materials
8. Polymeric Materials
9. Thin Films
10. Mechanical Behavior & Fracture
11. Fundamental Materials Science
12. Materials Applications, Performance and Life Cycle
13. Materials Property and Characterization
14. Nanostructured Materials
15. Sensors and structural identification
16. Active polymers, materials and actuators
17. Smart Biomaterials and Bioinspired Smart Materials and Systems
18. Energy Storage Materials and Energy Harvesting
19. Quantum Materials and Metamaterials
20. Piezoelectrics and Piezomagnetics
21. Materials for electronics application and optics
Track 2. Advanced Manufacturing Technology
1. Conventional and non-conventional machining process and their hybridization
2. Advanced finishing Processes
3. Surface Engineering/Coatings
4. Material Forming & Joining
5. Materials Machining
6. Material Design and development
7. Microwave Processing of Materials
8. Untrapericion Machining
9. Micro-Machining
10. Laser Machining and Sintering
11. Bio-manufacturing
12. Additive manufacturing
Track 3. Deformation, Damage and Physical Behavior of Materials
1. Fracture and damage, fatigue, dynamic fracture, dynamic behavior
2. Tribology and wear,
3. Interfaces and interphases,
4. Creep and aggressive environment
5. Corrosion
6. The above list of topics is indicative and not restrictive.
7. Electronic and optical
8. Ferromagnetic
Track 4: Microstructure and Property Evolution in Advance and Additive Manufacturing
1. Solidification dynamics in metal AM
2. Grain growth, porosity, and defect analysis
3. Phase transformation under rapid thermal cycling
4. Crystallographic texture and residual stress
5. Interfacial phenomena in hybrid manufacturing
6. Experimental studies on mechanical behaviour of AM parts
7. Post-processing effects on microstructure and properties
Track 5: Experimental Characterization and Materials Diagnostics
1. Electron microscopy (SEM, TEM, EBSD)
2. XRD, Raman, FTIR, UV-Vis spectroscopy
3. Nanoindentation and tribological testing
4. Mechanical behaviour under extreme environments
5. In-situ characterization during processing
6. Thermal analysis: DSC, TGA, DTA
Track 5: Computational and Theoretical Modeling of Materials and Processes
1. Molecular dynamics and atomistic simulations
2. Density Functional Theory (DFT) for property prediction
3. Phase-field modelling and CALPHAD
4. Finite element modelling of AM and forming processes
5. Multiscale/Multiphysics simulations of materials behaviour
6. Process–structure–property relationship modelling

Important Guidelines

Plagiarism is an offense. Authors must ensure that the Similarity Index of their submission remains strictly below 10%. All manuscripts will be screened using Turnitin. ICAMMP 2025 organizers and the publisher reserve the right to reject any paper at any stage if the similarity index exceeds this threshold. If a final accepted paper is later found to contain plagiarized content, it will be removed from the conference proceedings and indexing platforms.

The full research papers, work-in-progress reports, as well as high-quality review papers are welcomed in ICAMMP 2025.
Simultaneous submission of the same manuscript to any other conference, journal, or workshop is strictly prohibited.
Authors are required to certify that their paper represents original work and has not been published or submitted elsewhere.
Before submitting a paper to this conference, authors must carefully read and follow the Author Guidelines available on the conference website.
Authors must ensure that their manuscript does not violate any copyrights, patents, or intellectual property rights of others.
All papers will undergo a rigorous double-blind peer review process coordinated by the ICAMMP 2025 editorial team. Authors must ensure that their manuscripts are fully anonymized and free of any identifying information.
The submitted papers will be reviewed by the International Technical Program Committee and will be subject to a thorough revision process to ensure academic quality, ethical compliance, and thematic relevance.
All accepted papers must be revised thoroughly based on the reviewers’ comments and submitted before the final deadlines.
Additionally, authors must clearly declare the use of any AI-based tools (e.g., for text generation or image creation) in their manuscript. Manuscripts containing excessive AI-generated content (over 20%) may be returned for revision or rejected, in alignment with conference ethics.
ICAMMP 2025 organizers or the publisher retain the right to reject a paper at any point during the review, revision, or publication process if it violates the ethical standards outlined above.

Peer Review Process

Each submitted manuscript will receive a unique paper id. The manuscripts will be initially screened to check for the conference scope, plagiarism and originality. All the submitted manuscripts will be sent for technical peer review process and the corresponding author will be notified the outcome of the review process. ICAMMP 2025 adopts peer review process. If reviewers recommended for further improvements in the manuscript, the manuscript will be sent back to the corresponding author and the revised version of the manuscript shall be re-submitted timely. The final decision on the manuscript will be announced after the third round of evaluation by the conference committee.

Ready to Submit ?

Ready to submit your research? Ensure your paper aligns with the conference themes and guidelines. Click the below buttons to download & upload your manuscript and contribute to our scholarly exchange. Join us in shaping the future of additive manufacturing and materials science. Your insights are valuable to the success of ICAMMP 2025!

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